2-Layer 32-Gb ReRAM Memory Device in 24-nm Technology.
Tz-Yi LiuTian Hong YanRoy ScheuerleinYingchang ChenJeffrey KoonYee LeeGopinath BalakrishnanGordon YeeHenry ZhangAlex YapJingwen OuyangTakahiko SasakiAli Al-ShammaChin-Yu ChenMayank GuptaGreg HiltonAchal KathuriaVincent LaiMasahide MatsumotoAnurag NigamAnil PaiJayesh PakhaleChang Hua SiauXiaoxia WuYibo YinNicolas NagelYoichiro TanakaMasaaki HigashitaniTim MinvielleChandu GorlaTakayuki TsukamotoTakeshi YamaguchiMutsumi OkajimaTakayuki OkamuraSatoru TakaseHirofumi InoueLuca FasoliPublished in: IEEE J. Solid State Circuits (2014)