Numerical simulation approach on stress and strain for chip scale package under thermal cycling.

Yang Ping Wei Li

Published in: Int. J. Manuf. Technol. Manag. (2009)

Keyphrases

numerical simulations
finite element analysis
solder ball connect
stress distribution
heat transfer
theoretical analysis
finite element model
temperature field
high speed
numerical calculation
infrared
finite element
finite element method
scale space
computational fluid dynamics
lattice boltzmann
image processing
fluid dynamics
neural network