Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles.
F. B. SimonS. A. LetzAndreas SchletzPublished in: Microelectron. Reliab. (2018)
Keyphrases
- dynamic power management
- power consumption
- power management
- energy efficiency
- energy consumption
- total energy
- data center
- electrical power
- chip design
- energy saving
- wireless sensor networks
- heat flow
- pulse width
- ibm power processor
- low cost
- finite element
- data sets
- power system
- numerical simulations
- estimation algorithm
- temperature field
- simulation model
- energy dissipation
- training samples
- memory subsystem
- density estimation
- cmos technology
- physical design
- transmission line
- monte carlo simulation
- soft tissue