Finite element modeling on electromigration of solder joints in wafer level packages.

P. Dandu X. J. Fan Y. Liu C. Diao

Published in: Microelectron. Reliab. (2010)

Keyphrases

finite element
finite element analysis
mesh generation
finite element model
numerical solution
material properties
soft tissue
finite element method
finite difference
semiconductor manufacturing
real time
free form deformation
boundary element