Login / Signup
Embedded Tutorial ET3: Packaging Trends, Die Package Co-Design Flow and Challenges.
Siva Kothamasu
Published in:
VLSI Design (2012)
Keyphrases
</>
high speed
fundamental principles
key issues
artificial intelligence
lessons learned
embedded systems
technical challenges
information flow
databases
future trends
flow patterns
cellular automata
mobile devices
application scenarios
open issues
fluid flow
real world