TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model.
Meng-Kai HsuValeriy BalabanovYao-Wen ChangPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2013)
Keyphrases
- computational model
- weighted average
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- artificial neural networks
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- parameter estimation
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- database
- probabilistic model
- multiscale
- mathematical model
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