3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect.
Chiyen KimDavid EspalinMin LiangHao XinAlejandro CuaronIssac VarelaEric MacDonaldRyan B. WickerPublished in: IEEE Access (2017)
Keyphrases
- multi layered
- electronic circuits
- electrical engineering
- computer engineering
- high speed
- neural learning
- high reliability
- optical character recognition
- mathematical expressions
- general purpose
- cost effective
- data sets
- distribution networks
- electro mechanical
- printed circuit boards
- distributed memory
- high efficiency
- gesture recognition
- digital libraries