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Wafer-Level Vacuum Packaging of Smart Sensors.

Allan HiltonDorota S. Temple
Published in: Sensors (2016)
Keyphrases
  • high speed
  • real time
  • sensor data
  • multi sensor
  • integrated circuit
  • sensor networks
  • massively parallel
  • high level
  • data fusion
  • levels of abstraction
  • smart environments