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A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron.
Tomohito Suzuki
Yuhei Imai
Hiroyuki Manabe
Published in:
UIST (Adjunct Volume) (2022)
Keyphrases
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high speed
rapid prototyping
inductive logic programming
magnetic field
cross domain
transfer learning
relational learning
rule learning
development process
knowledge transfer
analog vlsi
information retrieval
data mining
database
artificial intelligence
circuit design
logic circuits