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Deformation and damage of a solder-copper joint.

P. TropeaAïssa MellalJohn Botsis
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • printed circuit boards
  • semiconductor devices
  • image registration
  • thin film
  • information systems
  • finite element method
  • joint estimation
  • real time
  • mechanical properties
  • magnetic recording
  • damage detection