Effects of copper CMP and post clean process on VRDB and TDDB at 28nm and advanced technology node.
Li Chieh HsuYu-Min LinChien Liang WuWei Kun LeeYen Chun LiuCheng Pu ChiuHsin Kuo HsuChun Yi WangChien Chung HuangChin Fu LinPublished in: IRPS (2015)