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Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition.

Cong ChenLibing BaiJun LuoJiahao WangQuan ZhouJie ZhangLulu TianWei HuangYuhua Cheng
Published in: IECON (2022)
Keyphrases
  • neural network
  • simulation software
  • sufficient conditions
  • building blocks
  • infrared
  • real time
  • website
  • image registration
  • medical images