TSV-aware 3-D IC structural planning with irregular die-size.
Arko DuttPranab RoyHafizur RahamanPublished in: APCCAS (2016)
Keyphrases
- decision support
- data sets
- scales linearly
- information systems
- decision making
- mixed initiative
- multimedia
- heuristic search
- small size
- planning problems
- irregularly shaped
- stochastic domains
- plan generation
- fixed size
- structural analysis
- ai planning
- maximum number
- structural information
- dynamic environments
- multiresolution
- database systems
- image processing
- knowledge base
- computer vision
- social networks
- data mining