Evaluation of energy-recovering interconnects for low-power 3D stacked ICs.
Panagiotis AsimakopoulosGeert Van der PlasAlexandre YakovlevPaul MarchalPublished in: 3DIC (2009)
Keyphrases
- low power
- power consumption
- low cost
- high speed
- cmos technology
- power dissipation
- energy dissipation
- energy efficiency
- ultra low power
- wireless transmission
- vlsi circuits
- high power
- single chip
- input output
- logic circuits
- energy saving
- low power consumption
- delay insensitive
- energy consumption
- image sensor
- digital signal processing
- real time
- power reduction