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Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.
Fen Chen
J. Gill
Dave Harmon
T. Sullivan
A. Strong
B. Li
H. Rathore
Daniel C. Edelstein
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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thermal conductivity
high speed
image processing
complex structures
high levels
data sets
computer vision
image analysis