Login / Signup

An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications.

Cai ChenYu ChenYuxiong LiZhizhao HuangTeng LiuYong Kang
Published in: IEEE Trans. Ind. Electron. (2017)
Keyphrases
  • computationally efficient
  • support vector machine svm
  • real time
  • back propagation
  • control algorithm