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Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects.
Sherry Suat Cheng Khoo
Pee Ya Tan
Steven H. Voldman
Published in:
Microelectron. Reliab. (2003)
Keyphrases
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transmission line
network reliability
power system
input output
power distribution
electrical power
dynamic characteristics
wave propagation
machine learning
differential equations
small size