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Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects.

Sherry Suat Cheng KhooPee Ya TanSteven H. Voldman
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • transmission line
  • network reliability
  • power system
  • input output
  • power distribution
  • electrical power
  • dynamic characteristics
  • wave propagation
  • machine learning
  • differential equations
  • small size