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3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs.
Reza Mirosanlou
Mohammadkazem Taram
Zahra Shirmohammadi
Seyed Ghassem Miremadi
Published in:
CoRR (2019)
Keyphrases
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low overhead
load balancing
high reliability
energy efficient
shared memory
communication cost
real time
data analysis
communication networks
scheduling algorithm