Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics.
Silke H. ChristiansenRajendra SinghUlrich GoselePublished in: Proc. IEEE (2006)
Keyphrases
- long term
- software engineering
- integrated circuit
- mechanical engineering
- engineering students
- engineering design
- web intelligence
- real time
- artificial intelligence
- computer science
- expert systems
- massively parallel
- computational intelligence
- predicting future
- engineering problems
- object oriented
- wireless sensor networks
- genetic algorithm
- neural network
- data sets