Numerical analysis of bonding process-induced deformation for 3D package.

Sung-Hoon Choa Haeng-Soo Lee Kyoung-Ho Kim

Published in: 3DIC (2011)

Keyphrases

numerical analysis
database
data sets
database systems
search algorithm
image enhancement
finite difference
data mining
feature selection
bayesian networks
expert systems
process model
diffusion process