Login / Signup

Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas.

Yung-Sen LinJian-Zhi XuShih-Wei TienShih-Chan HungWei-Li YuanTsair-Wang ChungChar-Ming Huang
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • low cost
  • high speed
  • real time
  • database
  • physical design
  • motion picture
  • data sets
  • search engine
  • image processing
  • case study
  • infrared
  • anisotropic diffusion