Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas.
Yung-Sen LinJian-Zhi XuShih-Wei TienShih-Chan HungWei-Li YuanTsair-Wang ChungChar-Ming HuangPublished in: Microelectron. Reliab. (2012)