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Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework.

Zhanwei ZhongTom B. WrigglesworthEugene M. ChowKrishnendu Chakrabarty
Published in: VTS (2019)
Keyphrases
  • cost reduction
  • cost savings
  • lead time
  • case study
  • probabilistic model
  • decision making
  • response time