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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding.

Simon J. BleikerMaaike M. Visser TakloNicolas LietaerAndreas VoglThor BakkeFrank Niklaus
Published in: Micromachines (2016)
Keyphrases
  • cost efficient
  • imaging sensors
  • integrated circuit
  • high resolution
  • dynamic range
  • multiscale
  • field of view
  • time of flight