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A study of through package vias in a glass interposer for multifunctional and miniaturized systems.
Abderrahim El Amrani
Abdellah Benali
Mohsine Bouya
Mustapha Faqir
K. Demir
Abdelkader Hadjoudja
Mounir Ghogho
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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distributed systems
artificial intelligence
empirical studies
information systems
knowledge based systems
building blocks
genetic algorithm
management system
computer systems
theoretical framework
factors affecting
user groups