Login / Signup

The effect of die attach voiding on the thermal resistance of chip level packages.

Amy S. FleischerLi-hsin ChangBarry C. Johnson
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • solder ball connect
  • high speed
  • low cost
  • expert systems
  • higher level
  • database
  • real time
  • artificial intelligence
  • input output
  • single chip