Sign in

Application of multi-fidelity simulation modelling to integrated circuit packaging.

Liam Y. HsiehEdward HuangChun-Hung ChenSi ZhangKuo-Hao Chang
Published in: Int. J. Simul. Process. Model. (2016)
Keyphrases
  • integrated circuit
  • neural network
  • low cost
  • case study
  • pattern recognition
  • simulation model
  • simulation models