Physically Justifiable Die-Level Modeling of Spatial Variation in View of Systematic Across Wafer Variability.
Lerong ChengPuneet GuptaCostas J. SpanosKun QianLei HePublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2011)
Keyphrases
- higher level
- levels of abstraction
- lower level
- information retrieval
- computer vision
- spatio temporal
- data sets
- modeling method
- spatial information
- spatial data
- multi view
- high level
- data mining
- website
- knowledge base
- multiple views
- spatial relationships
- geographic information systems
- machine learning
- spatial temporal
- database
- shape variations