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3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package.

Yong LiuLihua LiangScott IrvingTimwah Luk
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • infrared
  • databases
  • neural network
  • integrated circuit
  • software package
  • real world
  • social networks
  • multiscale
  • data structure
  • power plant
  • negative impact
  • electrical power