Low temperature Si/Si wafer direct bonding using a plasma activated method.
Dong-ling LiZheng-guo ShangSheng-qiang WangZhi-yu WenPublished in: J. Zhejiang Univ. Sci. C (2013)
Keyphrases
- high accuracy
- clustering method
- image sequences
- evaluation method
- neural network
- cost function
- fully automatic
- synthetic data
- preprocessing
- main contribution
- support vector machine svm
- computationally efficient
- matching algorithm
- detection method
- objective function
- prior knowledge
- support vector machine
- probabilistic model
- experimental evaluation
- dynamic programming
- significant improvement