3D serial TSV link for low-power chip-to-chip communication.
Giulia BeanatoAlessandro CevreroGiovanni De MicheliYusuf LeblebiciPublished in: ICICDT (2014)
Keyphrases
- low power
- high speed
- low cost
- single chip
- mixed signal
- cmos technology
- low power consumption
- power consumption
- power dissipation
- signal processor
- ultra low power
- image sensor
- vlsi circuits
- nm technology
- cmos image sensor
- high power
- digital signal processing
- multi channel
- wireless transmission
- logic circuits
- multithreading
- image processing
- hardware and software
- delay insensitive
- gate array