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An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration.

Jean-Etienne LorivalFrancis CalmonFengyuan SunFelipe FrantzCarole PlossuMartine Le BerreIan O'ConnorOlivier ValorgeJean CharbonnierDavid HenryChristian Gontrand
Published in: Microelectron. J. (2015)
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