An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration.
Jean-Etienne LorivalFrancis CalmonFengyuan SunFelipe FrantzCarole PlossuMartine Le BerreIan O'ConnorOlivier ValorgeJean CharbonnierDavid HenryChristian GontrandPublished in: Microelectron. J. (2015)