Warp Measurement for Large-Diameter Silicon Wafer Using Four-Point-Support Inverting Method.
Yukihiro ItoMasanori KuniedaPublished in: Int. J. Autom. Technol. (2017)
Keyphrases
- pairwise
- detection method
- significant improvement
- high accuracy
- genetic algorithm
- optimization method
- classification method
- matching algorithm
- synthetic data
- clustering method
- mutual information
- low cost
- experimental evaluation
- dynamic programming
- prior knowledge
- similarity measure
- image processing
- probabilistic model
- optimization algorithm
- cost function
- feature space
- data sets