Ballistic deposition simulation of via metallization using a quasi-three-dimensional model.
Tom J. SmyR. Niall TaitMichael J. BrettPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (1991)
Keyphrases
- three dimensional
- computational model
- simulation model
- mathematical model
- theoretical analysis
- probabilistic model
- neural network
- theoretical framework
- high level
- data sets
- mobile robot
- cost function
- objective function
- image sequences
- social networks
- statistical model
- mathematical models
- agent model
- simulation environment