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Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure.
Yuling Shang
Liyuan Sun
Chunquan Li
Jianfeng Ma
Published in:
J. Electron. Test. (2017)
Keyphrases
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complex structures
highly structured
structural properties
data mining
complex environments
complex data
high speed
complex systems
graphical models
temporal ordering
geometric structure
higher level
real time
mobile robot
hidden markov models
multi agent
high level
computer vision
data sets