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New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs).

Yintang YangJunping ZhengGang DongYingbo ZhaoZheng MeiWeijun Zhu
Published in: IEICE Electron. Express (2016)
Keyphrases
  • integrated circuit
  • three dimensional
  • real time
  • neural network
  • case study
  • image analysis