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New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs).
Yintang Yang
Junping Zheng
Gang Dong
Yingbo Zhao
Zheng Mei
Weijun Zhu
Published in:
IEICE Electron. Express (2016)
Keyphrases
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integrated circuit
three dimensional
real time
neural network
case study
image analysis