Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures.

Masaki Omiya Kozo Koiwa Nobuyuki Shishido Shoji Kamiya Chuantong Chen Hisashi Sato Masahiro Nishida Takashi Suzuki Tomoji Nakamura Toshiaki Suzuki Takeshi Nokuo

Published in: Microelectron. Reliab. (2013)

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