Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures.
P. RajamandRainer TilgnerRoland SchmidtJ. BaumannP. KlofacM. RothenfusserPublished in: Microelectron. Reliab. (2003)
Keyphrases
- high levels
- wide range
- image analysis
- thermal conductivity
- significantly lower
- infrared
- high sensitivity
- highly correlated
- image processing
- high throughput
- small size
- image stacks
- source localization
- electric field
- low signal to noise ratio
- high correlation
- structured light
- high precision
- mobile robot
- control system
- image segmentation