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Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling.

Van Nhat LeLahouari BenabouVictor EtgensQuang Bang Tao
Published in: Microelectron. Reliab. (2016)
Keyphrases
  • finite element analysis
  • finite element
  • neural network
  • pattern recognition
  • database
  • machine learning
  • genetic algorithm
  • numerical simulations
  • finite element model