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Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape.

Jong-Sung LeeSuncheul KimDonghoon HanMyoung-Gyu LeeYoung-Chang Joo
Published in: IEEE Access (2022)
Keyphrases
  • thin film
  • statistical analysis
  • data sets
  • image processing
  • three dimensional
  • object recognition
  • data analysis
  • image analysis
  • quantitative analysis
  • automatic analysis
  • shape retrieval