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A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging.
Junhui Li
Haoliang Zhang
Can Zhou
Zhuo Chen
Xinxin Chen
Zhili Long
Xiaohe Liu
Wenhui Zhu
Published in:
IEEE Trans. Ind. Informatics (2019)
Keyphrases
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multiscale
expert systems
numerical analysis
discrete event simulation
colored petri nets
database
information retrieval
artificial intelligence
image processing
case study
image segmentation
design process
process model
mathematical model
simulation model
modeling tool