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New assembling technique for BGA packages without thermal processes.
Valentin Videkov
Slavka Tzanova
Radosvet Arnaudov
Nikolai Iordanov
Published in:
Microelectron. Reliab. (2001)
Keyphrases
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solder ball connect
infrared
database
real world
genetic algorithm
face recognition
decision support system
path planning
power plant
software packages