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Next generation backplane and copper cable challenges.

Roy D. CideciyanMark GustlinMike Peng LiJohn WangZhongfeng Wang
Published in: IEEE Commun. Mag. (2013)
Keyphrases
  • lessons learned
  • key issues
  • thin film
  • application scenarios
  • paradigm shift
  • open issues
  • database
  • real world
  • machine learning
  • multiscale
  • open questions