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Front-plane and Back-plane Bias Temperature Instability of 22 nm Gate-last FDSOI MOSFETs.
Yang Wang
Chen Wang
Tao Chen
Hao Liu
Chinte Kuo
Ke Zhou
Binfeng Yin
Lin Chen
Qing-Qing Sun
Published in:
IRPS (2020)
Keyphrases
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three dimensional
neural network
real time
case study
low cost
ground plane
free space