A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link.
Andrew TownleyNima BaniasadiSashank KrishnamurthyConstantine SiderisAli HajimiriElad AlonAli M. NiknejadPublished in: CICC (2020)
Keyphrases
- fully integrated
- high speed
- dual channel
- wireless link
- cmos technology
- low power
- ultra low power
- nm technology
- silicon on insulator
- metal oxide semiconductor
- power consumption
- low cost
- wimax network
- quality of service
- real time
- frame rate
- base station
- phase locked loop
- congestion control
- workflow management
- image sensor
- packet loss
- data acquisition
- wireless networks
- power dissipation
- service oriented
- ad hoc networks