Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5D Chiplet Platforms and Beyond.
Jaehyun ParkAlish KananiLukas PfrommHarsh SharmaParth SolankiEric TervoJanardhan Rao DoppaPartha Pratim PandeÜmit Y. OgrasPublished in: VTS (2024)