New precision wafer bonding technologies for 3DIC.

Isao Sugaya Hajime Mitsuishi Hidehiro Maeda Kazuya Okamoto

Published in: 3DIC (2015)

Keyphrases

high precision
data mining
emerging technologies
high recall
semiconductor manufacturing
software tools
web intelligence
massively parallel
semantic technologies
database
genetic algorithm
artificial intelligence
information technology
st century