A Hybrid Wafer Processing Cycle Prediction Model Based on DPC-Relief-F.
Jiabin DaiJie ZhangJunliang WangLihui WuPublished in: CASE (2022)
Keyphrases
- prediction accuracy
- prediction error
- real time
- high prediction accuracy
- information processing
- case study
- semiconductor manufacturing
- prediction algorithm
- hybrid learning
- data processing
- integrated circuit
- prediction model
- database
- computer vision
- massively parallel
- machine learning
- genetic algorithm
- search engine
- high speed
- long term
- query processing
- expert systems