The Relationship between Packaging Structures, Chip Area and Thermal Resistance of NMOS Semiconductor in Transient Dual Interface Method.
Fan ChenDapeng LiuLong ChenShuai TaoJun YouZebin KongPublished in: EITCE (2021)
Keyphrases
- high accuracy
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- high precision
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- pairwise
- similarity measure
- prior knowledge
- high speed
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- synthetic data
- evolutionary algorithm
- artificial neural networks
- image processing
- probabilistic model
- objective function
- clustering method
- decision trees