Integrated data envelopment analysis and neural network model for forecasting performance of wafer fabrication operations.
Chia-Yu HsuPublished in: J. Intell. Manuf. (2014)
Keyphrases
- neural network model
- data envelopment analysis
- forecasting accuracy
- wafer fabrication
- neural network
- input output
- artificial neural networks
- bp neural network
- efficient frontier
- multi criteria
- dea models
- multiple objective programming
- forecasting model
- back propagation neural network
- autoregressive model
- neural models
- linear programming
- dea model
- short term
- rbf neural network
- multiple objective linear programming
- hopfield network
- multi dimensional
- support vector regression
- probability distribution