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Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs.

Pooria M. YaghiniAshkan EghbalSiavash S. YazdiNader BagherzadehMichael M. Green
Published in: IEEE Trans. Computers (2016)
Keyphrases
  • databases
  • case study
  • machine learning
  • information systems
  • decision trees
  • image segmentation
  • multiscale
  • knowledge representation
  • data mining techniques
  • strengths and weaknesses
  • alternative approaches